| abstract |
(57) [Problem] To be used as a dicing tape in a dicing process, and as an adhesive having excellent connection reliability in a joining process of a semiconductor element and a support member. Provided is an adhesive sheet having heat resistance and moisture resistance necessary for mounting a semiconductor element having a large difference between the two, and excellent in workability. SOLUTION: (A) an epoxy resin and an epoxy resin curing agent, (B) a high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more, (C) (a) diols, and (b) a general formula ( I) An isocyanate compound represented by the general formula (I) I) A heat-polymerizable and radiation-polymerizable adhesive sheet, comprising a pressure-sensitive adhesive layer containing a radiation-polymerizable compound composed of a compound represented by the formula: and a base material layer. |