| abstract |
(57) Abstract: An object of the present invention is to provide an epoxy resin composition which is easy to handle when mixed with a mesogen-containing epoxy resin and a curing agent, and a conductive paste using the same. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin comprises (A) an epoxy compound having one mesogen in the molecule and (B) a compound having two active hydrogens in the molecule. An epoxy resin composition, which is a reaction product obtained by reacting the active hydrogen of the component (B) with the epoxy group of the component (A) in an equivalent ratio of 0.25 to 0.7, and using the same. Conductive paste. |