http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002226525-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-04 |
filingDate | 2001-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25dda877d553807b8dfcacb47547d760 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b5f0ca7f1fa9bb86d059620cfd11155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88f1a4ed13c4aca27222acd7b429dce2 |
publicationDate | 2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002226525-A |
titleOfInvention | Resin composition and heat curing method using the same |
abstract | PROBLEM TO BE SOLVED: To provide a resin composition which has excellent surface curability at the time of curing and can form a molded article having excellent chemical resistance even without heat-cured surface seal such as a mylar film. And a heat curing method using the same. SOLUTION: The weight ratio of dicyclopentenyl groups is 20. To 45% by weight of an unsaturated polyester (a), a compound (b) having a (meth) acryloyl group, and a resin composition containing an aromatic monomer (c) having no (meth) acryloyl group And the content ratio is (a) is 3 0 to 80% by weight, (b) 3 to 30% by weight, and A resin composition wherein (c) is 5 to 60% by weight. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005179388-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004143393-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005048059-A |
priorityDate | 2001-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.