| abstract |
[PROBLEMS] To provide a semiconductor device mounting method, a mounting structure thereof, a semiconductor device manufacturing method, and a semiconductor device capable of obtaining good electrical characteristics of a connection portion. SOLUTION: A semiconductor chip 21 provided with a first protruding electrode 8 by thinning the back surface is connected to a first external terminal 25 of an intermediate substrate 22 and flip-chip mounted. Further, terminals are provided on both surfaces of the intermediate substrate. A second projecting electrode 24 is formed on one surface of the formed second external connection terminal 26, and the second projecting electrode 2 After the etching process 4 is performed using plasma, a plurality of intermediate substrates 22 are stacked and mounted via the second protruding electrodes 24. As a result, the surface of the second protruding electrode 24 is cleaned, the surface of the intermediate substrate 22 made of polyimide resin is chemically activated, and good electrical characteristics of the interlayer connection portion can be obtained. In this case, the adhesion between the sealing material and the intermediate substrate is improved. |