| abstract |
(57) [Problem] To provide a heat insulating material corresponding to an electronic member that generates the highest temperature in a device to flatten the temperature distribution on the device surface and pass the safety standard. With the goal. SOLUTION: The heat insulation and heat dissipation structure of the electronic device according to the present invention is an electronic device having a plurality of heat-producing electronic members (1a, 1b, 1c) on a bottom plate (1) provided on an outer case (2). Provide a heat insulating material (10) on the lower surface of the top plate (2b) of the case (2), and (2b) and an opening (11) provided in the bottom plate (1) obtain convection to perform heat insulation and heat radiation. |