http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002217512-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecdfc9030125055f06a260938acdacab |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2001-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f70832bed0abb79813d59b1c79ebd73e |
| publicationDate | 2002-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002217512-A |
| titleOfInvention | Circuit board structure |
| abstract | (57) [Summary] [Problem] To fill a through hole in a circuit board, a separate filling step is required, which increases the cost. SOLUTION: By drilling a minute through hole, the hole is filled at the same time in the conventional electroless and electrolytic copper plating process, It is possible to provide an inexpensive hole filling substrate. |
| priorityDate | 2001-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 14.