http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002212746-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c5561203784cbc604a4f34191a88204
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
filingDate 2001-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eadfb11d17cd82fd7f179bcaf9d6f39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b479783fde5ac17b368d26e9ee56295
publicationDate 2002-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002212746-A
titleOfInvention Electroless nickel plating method for plating object with non-through hole
abstract (57) Abstract: Provided is an electroless nickel plating method capable of forming a sufficient electroless nickel layer inside a non-through hole of an object to be plated having a non-through hole. An object to be plated having an unpenetrated hole is immersed in a first stage electroless nickel plating solution to fill the electroless nickel plating solution with the electroless nickel plating solution. A method for performing electroless nickel plating by dipping the nickel plating solution in a second stage electroless nickel plating solution in a state where the nickel plating solution remains, wherein the first stage electroless nickel plating solution contains no nickel compound. An electroless nickel plating method for an object to be plated having a non-through hole, characterized by containing not less than 15 mol / l and not less than 0.25 mol / l of a pH buffer.
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