| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9c06a952227034c3f1d3a57b919d820
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56273294d768a6eb535c01b3fbad53aa |
| publicationDate |
2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002208768-A |
| titleOfInvention |
Method for forming metal plating film on polyimide substrate |
| abstract |
(57) Abstract: The present invention secures adhesion to a metal film without impairing the chemical stability of the polyimide when depositing a metal film such as copper on a polyimide substrate by an electroless plating method. An object of the present invention is to provide a method for forming a metal plating film that can be applied (applicable to the additive method). In a method of forming a metal plating film for forming a conductive circuit pattern on a surface of a polyimide substrate, an organic disulfide compound having a primary amino group or a primary amino group is prepared by preliminarily coating the surface of the polyimide substrate in the presence of an alkaline substance. A method for producing a metal plating film, comprising treating with a solution containing an organic thiol compound having: |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019173112-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009032957-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103966582-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1772190-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4529695-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008202109-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100841414-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005225228-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010525169-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005068185-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100482034-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8093349-B2 |
| priorityDate |
2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |