| abstract |
(57) [Summary] [PROBLEMS] To enable a printed circuit board to be cut accurately without being damaged by heat or physical destruction. A printed board (3) is placed on a processing table (2) via a flexible material (4). By using the flexible material 4, The solder protrusions 3a and the like on the lower surface of the printed board 3 can be absorbed. The printed circuit board 3 is pressed from above by using the pressing mechanism 5. Due to this pressing, deformation such as warpage generated in the printed board 3 is corrected, and the printed board 3 is held on the processing table 2 in a completely flat state. Then, in this state, the printed circuit board 3 is cut by the water jet 7 discharged from the water jet nozzle 6. |