| abstract |
PROBLEM TO BE SOLVED: To provide a thermally enhanced semiconductor chip having a junction integrated on an active circuit and easy to manufacture. The integrated circuit chip (200) has a power distribution line (25) having a thermal conductance at least one order of magnitude greater than the underlying thin film electrical interconnects (204a-204n). 1,252 metal networks. These lines are deposited on the surface of the chip and the active IC component 2 02, 203, and electrically and thermally connected vertically to selected active components under the tracks. The conductors 271, 272 can operate to connect these lines to an external power supply. Additional electrically non-functional conductors 271, 272 are distributed on the line and can be operated to increase the temperature gradient for removing heat flow from the active components and the line. |