| abstract |
PROBLEM TO BE SOLVED: To provide a bump forming method, a semiconductor device and a method of manufacturing the same, a circuit board and an electronic device, which correspond to a narrow pitch of pads and have resistance to electroless plating. is there. SOLUTION: The bump forming method includes a step of patterning a resist layer 20 so as to have a through hole 22 above a pad 12, and a step of applying energy 36 for causing a cross-linking reaction to the resist layer 20 to at least form the resist layer 20. Curing the surface, and forming metal layers 40 and 42 electrically connected to the pads 12 in the through holes 22; including. |