| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db496c7f79f0dfbca146c6a7100e0992 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05559
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0271230fe1c829865e8e62207bcc6c98 |
| publicationDate |
2002-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002198534-A |
| titleOfInvention |
Semiconductor device and method of manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To protect a source electrode from being corroded by a corrosive substance from an opening of a cover insulating film for forming a bonding pad, via an opening of the cover insulating film on the source electrode. When the TiNiAg film is covered by the lift-off method, there is a problem that the source electrode is exposed from between the cover insulating film and the TiNiAg film. SOLUTION: As a cover insulating film 22, a silicon nitride film 22a and a PSG film 22b are sequentially laminated, and a TiNiAg film 23 is formed on a source electrode 20 through openings of the silicon nitride film 22a and the PSG film 22b. P The opening of the SG film 22b is formed wider than the opening of the silicon nitride film 22a so that a step occurs at the opening end as the cover insulating film 22, and the step surface 22c is formed by the surface of the silicon nitride film 22a exposed from the PSG film 22b. The TiNiAg film 23 is formed on this step surface 2 by a lift-off method. 2c is overlapped and covered. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7547976-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8089165-B2 |
| priorityDate |
2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |