| abstract |
(57) [Problem] To cure an electron beam which can be easily used for forming an antenna, a circuit of a printed circuit board, a conductive layer for interlayer connection, an electrode of a display device, and a solder substitute for connecting an IC chip. Provide mold conductive paste. An electron beam-curable conductive paste containing a conductive powder and an electron beam-curable component containing a compound curable by an electron beam, wherein the conductive powder has (1) an average particle size of 0.05 to Mass ratio (1) / (2) of 1 μm dendritic conductive powder and (2) scale-like conductive powder having an average particle size of 1 to 10 μm = 60/40 to 95/5 is used as the conductive powder, which is a conductive powder containing 80% by mass or more of the total conductive powder. |