http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002194180-A

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filingDate 2000-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002194180-A
titleOfInvention Epoxy resin composition and semiconductor encapsulation device
abstract (57) [Problem] To provide an epoxy resin composition and a semiconductor encapsulation device which are excellent in warpage characteristics, moisture resistance, solder heat resistance, moldability, and mounting reliability, and can guarantee long-term reliability. (A) an epoxy resin represented by the following formula: (B) a phenolic resin, (C) an epoxy group-containing silane coupling agent containing a trace amount of an organic base such as an amine, (D) Spherical silicone rubber powder having a maximum particle size of 40 μm or less (E) Spherical silica powder having a maximum particle size of 40 μm or less and (F) a curing accelerator are essential components. A) an epoxy resin composition containing the spherical silica powder of 25) to 90% by weight, and a semiconductor chip sealed with a cured product of the epoxy resin composition.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011105911-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011105898-A
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Total number of triples: 27.