http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002194102-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2000-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ce3eeb15dac8588f4ea532b6a93f5c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815390379a9ce6eab8a10c64c177d45c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75f712aa679d32e87d7167f2ac518c3c |
| publicationDate | 2002-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002194102-A |
| titleOfInvention | Laminated board manufacturing method, laminated board and printed wiring board |
| abstract | (57) [Summary] An object of the present invention is to provide a phenolic resin laminate for a double-sided printed wiring board without disconnection of silver through holes. A varnish is prepared by using a resin solid content and a solvent as main components, and in a method of manufacturing a laminated board in which an insulating layer is formed using the varnish, a varnish is used in an amount of 80 to 1 with respect to the total amount of the solvent. 00% by weight is a solvent having a boiling point of less than 100 ° C. |
| priorityDate | 2000-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.