http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002190660-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22 |
| filingDate | 2000-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d18840bbeae80ea44c867acfda4e5eeb |
| publicationDate | 2002-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002190660-A |
| titleOfInvention | Wiring board repair method and wiring board |
| abstract | (57) Abstract: A method for repairing a wiring board which improves the adhesion between a wiring board and a print mask in solder printing and improves the cleaning property of a flux used when soldering a semiconductor device to the wiring board. And a wiring board. According to the method of repairing a wiring board of the present invention, a wiring connection is made between correction points on the surface of the wiring board using fine lines, and the fine lines wired on the wiring board are completely connected. It includes a step of applying an insulating material 8 with a uniform thickness so as to cover, and a step of providing a solder pad opening 9 in the insulating material 8 on the connection pad 5 formed on the wiring board 1. The wiring board according to the present invention includes a fine line 3 that connects and connects the correction points on the surface of the wiring board 1, an insulating material 8 that covers the fine line 3 and covers the entire surface of the wiring board 1, and has a flat surface. Insulating material 8 on connection pads 5 formed on wiring substrate 1 And a soldering pad opening 9 provided in the opening. |
| priorityDate | 2000-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57420512 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452198021 |
Total number of triples: 13.