http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002185141-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772dfed386c7c0d8a559bd366438f64a |
| publicationDate | 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002185141-A |
| titleOfInvention | Multilayer printed wiring board |
| abstract | (57) [Problem] To provide a multilayer printed wiring board capable of appropriately supplying power. In a multilayer printed wiring board, a plurality of via holes (160) are provided in a plane layer (58). The plurality of via holes 160 provided in the plane layer 58 for supplying power can reduce the electric resistance from the external substrate to the IC chip and appropriately supply power to the IC chip. Malfunction can be prevented. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016114170-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8993892-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016033933-A |
| priorityDate | 2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.