http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002185134-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6858bb0df3d210a133c6e979464ea65
publicationDate 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002185134-A
titleOfInvention Printed wiring board and manufacturing method thereof
abstract [PROBLEMS] To provide a printed wiring board having a uniform thickness that can provide interlayer conductivity of a conductor pattern by a simple method and that does not require control of plating thickness for pattern formation, and a method of manufacturing the same. provide. SOLUTION: A step of forming a conductor pattern 2 comprising a metal plating pattern layer 21 and a metal layer 22 laminated on a metal layer forming side of a carrier 3 and having a first conductive pad 20; A step of forming the insulating resin layer 1, a step of forming a via hole 5 having the first conductive pad as a bottom and supplying a conductive material 50 therein to obtain a laminated plate 84; It comprises a step of laminating on a separate wiring board 83 provided with the conductive pads 70 and bringing a conductive material into contact with the second conductive pads, a step of curing the insulating resin layer, and a step of removing carriers. .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7873245-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008235665-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7801396-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009047854-A1
priorityDate 2000-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 24.