| abstract |
(57) Abstract: Provided are a connection method which is excellent in accuracy and efficiency, a circuit board using the method, a method of manufacturing the same, and a semiconductor package and a method of manufacturing the same. A method for connecting a buried conductor buried in an insulating resin and a surface conductor on a surface of the insulating resin, wherein the distance between the buried conductor and the surface conductor is 50 μm or less. By removing the opening, removing the insulating resin exposed at the opening, and connecting the buried conductor and the surface conductor by plating, and using the connection method, the buried conductor is connected to the surface conductor and the surface conductor. A circuit board used as a connecting conductor for connecting an outer layer conductor on the opposite side of an insulating resin layer formed with a circuit board, a method of manufacturing the same, a semiconductor package, and a method of manufacturing the same. |