| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G81-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2000-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f76ed5b52a4a67c1897ffbef5e811a4e |
| publicationDate |
2002-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002172733-A |
| titleOfInvention |
Metal-coated polyimide film |
| abstract |
(57) [Problem] To provide a metal-clad polyimide film having sufficient mechanical strength and heat resistance. SOLUTION: A conductive substrate has a thickness of 1 μm or more and 10 μm or more. m, a metal layer having a thickness of not more than m, an insulating resin layer comprising an electrodeposition film formed of an organic soluble polyimide is provided on the surface of the metal layer, and then the conductive substrate is peeled off. A method for producing a polyimide film, and a metal-clad polyimide film produced by the method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008047676-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004358961-A |
| priorityDate |
2000-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |