http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002172634-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_02cfb0f1aa2718c61bdf184d53adfe79 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate | 2000-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_132b8a50055a182250bbf69e32f8dd97 |
| publicationDate | 2002-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002172634-A |
| titleOfInvention | Manufacturing method, manufacturing apparatus and temperature control condition determining method for resin bonded optical element |
| abstract | (57) [Summary] [Object] To suppress undulation of a resin layer and form a desired surface shape with high accuracy. A photosensitive resin composition layer is formed between a surface of a base material and a mold, and light 3 is applied to the photosensitive resin composition layer. Irradiate 3 and cure to form a resin layer composed of a cured product of the photosensitive resin composition, and release the resin layer from the mold. Irradiation with light for exposing the resin composition is performed while maintaining a temperature change of at least one of the base material, the mold and the photosensitive resin composition at ± 0.5 ° C. or less. |
| priorityDate | 2000-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15597427 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410438835 |
Total number of triples: 15.