http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002170820-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
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filingDate 2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d15ca2b469f4f800f2afcbd421e4857
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publicationDate 2002-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002170820-A
titleOfInvention Method of manufacturing thin film transistor and plasma processing apparatus used therein
abstract (57) Abstract: Provided is a method of manufacturing a thin film transistor for forming a gate insulating film of the thin film transistor under relatively low temperature conditions, and a plasma processing apparatus used for the method. SOLUTION: A heater stage 4 for mounting and heating a substrate 5 in a process chamber 1 is provided, and an exhaust port 2 is provided on a back surface thereof. An electrode 3 for supplying high-frequency power for plasma generation and a gas inlet 14 are provided at an upper portion in the process chamber 1. Between the electrode 3 and the heater stage 4, there is provided a plate 6 having a plurality of openings 19 whose opening ratio is changed according to the density distribution of the plasma generated by the electrode 3. . A dielectric member 7 such as quartz glass is fitted in the surface of the plate 6 in the opening 19 and its peripheral portion.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8895388-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003100646-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2004008519-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2004047157-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005268798-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I399839-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4673063-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007048968-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4703224-B2
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