http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002167555-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate | 2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60df2bdbe95997d5a6961c5952fd207c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_930e56f50380a9c93ec26b434383c9b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6542bb7a0e2a09022a466ede6627fdff |
| publicationDate | 2002-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002167555-A |
| titleOfInvention | Circuit adhesive for circuit connection, circuit terminal connection structure and circuit terminal connection method |
| abstract | (57) [Summary] (Modifications required) [Problem] Short-time connection is possible, and adhesiveness, connection reliability, Provided are a film-like adhesive for circuit connection having excellent storage stability, a connection structure for circuit terminals, and a method for connecting circuit terminals. SOLUTION: This is a film-like adhesive for circuit connection, which is interposed between opposing circuit electrodes, heats and presses the opposing circuit electrodes, and electrically connects the electrodes in the pressing direction. Radical polymerizable bifunctional or higher acrylate or methacrylate compound, 2) glass transition temperature of 50 ° C. Above, a thermoplastic resin having a melt viscosity at 150 ° C. of 10,000 Pa · s or less, 3) an organic peroxide, 4) a silane coupling agent having a radically polymerizable functional group as an essential component, and a radically polymerizable bifunctional A film-like adhesive for circuit connection, wherein the viscosity of the mixture of the acrylate compound or methacrylate compound and the silane coupling agent at 40 ° C. is 0.04 Pa · s or more. Further, a circuit connection adhesive containing conductive particles, and a circuit connection method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4655487-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8308991-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005226048-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007046189-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012111365-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007046190-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007177204-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011063760-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005320491-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005325312-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007046190-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007046189-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005066298-A1 |
| priorityDate | 2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 228.