abstract |
PROBLEM TO BE SOLVED: To provide a film adhesive having excellent heat resistance of a thermoplastic polyimide resin, excellent adhesion to a metal, a laminated board, and a printed circuit board and hardly foamed when thermocompression bonded. . SOLUTION: A film adhesive mainly containing a polyimide resin having a specific structure, an epoxy compound and a compound having an epoxy compound and a silane coupling agent is produced. |