http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002164384-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2000-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca63b0a1506f0df40e22979fcebc532f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2150a4736e219aee35cba30be235c893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_792eeeb9c0c95c6c5251c87a6d74547e |
| publicationDate | 2002-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002164384-A |
| titleOfInvention | Manufacturing method of semiconductor chip mounted body, bonding tool |
| abstract | (57) [Summary] (with correction) [PROBLEMS] To provide a method of manufacturing a semiconductor chip mounted body and a bonding tool capable of improving the productivity of flip chip bonding. SOLUTION: The hardness of a surface of a bonding tool 14 which contacts the semiconductor chip 11 at the time of bonding is designated, and the hardness is equal to or approximately equal to the hardness of the semiconductor chip 11. Vickers hardness of 7 times the value shall be used. According to the bonding tool 14 whose surface hardness is designated as described above, The extent to which the back surface of the semiconductor chip 11 is shaved and the detached material is deposited on the surface of the bonding tool 14 is reduced. Also, Since the surface of the bonding tool 14 is not softer than necessary, conversely, the degree to which the bonding tool 14 is shaved to cause irregularities on the surface is small. Therefore, the number of times that bonding can be performed without polishing or replacement of the bonding tool 14 can be increased, and the productivity of bonding can be improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7370786-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6932262-B2 |
| priorityDate | 2000-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 |
Total number of triples: 20.