abstract |
(57) [Problem] To provide a resin composition which is excellent in mold recovery property of a semiconductor sealing mold. (A) epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) urethane compound of oxidized microcrystalline wax and polyethylene oxide and / or oxidized microcrystalline wax and polyethylene oxide, and E) A mold release recovery resin composition for semiconductor encapsulation, comprising an inorganic filler. |