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filingDate 2000-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002161189-A
titleOfInvention Mold release recovery resin composition
abstract (57) [Problem] To provide a resin composition which is excellent in mold recovery property of a semiconductor sealing mold. (A) epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) urethane compound of oxidized microcrystalline wax and polyethylene oxide and / or oxidized microcrystalline wax and polyethylene oxide, and E) A mold release recovery resin composition for semiconductor encapsulation, comprising an inorganic filler.
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