http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002161128-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ee0780c3be5c2c9908ca8cfa480a270 |
| publicationDate | 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002161128-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] To reduce or eliminate bromine compounds and antimony compounds, and to store at high temperature because the warpage after molding and soldering is small, the reliability during soldering is excellent, and the flame resistance is also excellent. Epoxy resin composition for semiconductor encapsulation with improved properties, And a semiconductor device using the same. SOLUTION: (A) a phenol aralkyl type epoxy resin, (B) a triphenol methane type phenol resin, An epoxy resin composition for semiconductor encapsulation, comprising (C) a curing accelerator and (D) an inorganic filler as essential components. |
| priorityDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.