| abstract |
(57) [Summary] [PROBLEMS] To reduce uneven temperature around through holes such as insertion holes, vacuum suction holes, etc., to protect wafers from thermal shock, and to control temperature components such as thermocouples and temperature fuses. To provide a ceramic heater with improved controllability. Further, it is an object of the present invention to provide a ceramic heater for manufacturing and inspecting semiconductors capable of uniformly curing a resin. A heating element is provided on the surface or inside of a ceramic substrate. The insertion hole 1 of the ceramic substrate 12 6, corners of the concave portion 18, the vacuum suction hole 20 and the like are chamfered. |