http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002151631-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a6d1168a5a815433e8ffa4540d920b1 |
| publicationDate | 2002-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002151631-A |
| titleOfInvention | Epoxy resin molding material and semiconductor device |
| abstract | (57) [Summary]nPROBLEM TO BE SOLVED: To have excellent solder crack resistance and temperature cycle resistance. Obtained epoxy resin molding material for semiconductor encapsulation.nSOLUTION: Epoxy resin, phenol resin, inorganic charge Epoxy resin molding containing filler and curing accelerator -6 of the cured product of the epoxy resin molding material Bending energy at 5 ° C (a) and bending at 150 ° C The sum (a) + (b) of the breaking energies (b) is 0.2 N · m And the use of the epoxy resin molding material The piezo stress value (σ x Two + Σ y Two ) 1/2 Is 200 N / mm Two Features are Epoxy resin molding material for semiconductor encapsulation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002363258-A |
| priorityDate | 2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.