http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002151614-A

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filingDate 2000-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8338a15fd74004d10fe04e9ac03daa82
publicationDate 2002-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002151614-A
titleOfInvention Package for storing semiconductor elements
abstract (57) [Summary] In a package for housing a semiconductor element, it is not possible to effectively prevent junction breakdown due to heat-induced strain stress. SOLUTION: An insulating base 1 having a mounting portion 1a of a semiconductor element 7 on an upper surface, a frame 2 joined on the upper surface of the insulating base 1 so as to surround the mounting portion 1a, and a sealing agent on an upper surface of the frame 2 are provided. And a substantially flat metal cover 3 joined through the metal cover 4. Is located on the inner wall side of the frame 2 from just above the opening periphery along the portion of the lower surface facing the opening of the frame 2, the inclination angle α to the flat portion of the lower surface is 30 to 85 °, and the depth is 0.02. ~ 0.3mm 3. A package for accommodating a semiconductor element, wherein a frame-shaped groove 3a having a slope facing an opening edge is formed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016143845-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018142617-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016171143-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008005331-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008193581-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10103077-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007234977-A
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Total number of triples: 30.