| abstract |
PROBLEM TO BE SOLVED: To provide an excellent sensitivity and resolution, to be able to be rapidly developed only with an alkaline aqueous solution, to have excellent adhesion to a substrate, and to be a light-colored polyimide resin film after imidization. To provide a circuit board having a photosensitive resin composition and an insulating layer obtained from the photosensitive resin composition. SOLUTION: The photosensitive resin composition 2 contains a polyamic acid resin, a 1,4-dihydropyridine derivative, polyethylene glycol, and further a polyhydric phenol compound. According to such a photosensitive resin composition, development can be performed at a rapid development speed by using only an aqueous alkali solution as a developer, and as a result, a high sensitivity and a high resolution, a small film loss, and a good negative pattern Can be formed in a light color while preventing coloring. Therefore, a circuit board having an insulating layer obtained from this photosensitive resin is effectively used as a highly reliable circuit board. |