| abstract |
PROBLEM TO BE SOLVED: To provide a composition for depositing a mixed metal or metal compound layer containing a solvent-free mixture of at least two metal ligand complex precursors and deposition on an electronic material substrate Provide a way. The mixture is liquid under ambient conditions and the ligand is an alkyl, alkoxide, halide, hydride, amide, imide, azide, nitrate, cyclopentadiethyl, carbonyl, pyrazole and their fluorine, oxygen And a nitrogen-substituted analog. |