http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002145995-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2001-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2002-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002145995-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability, flame retardancy and solder stress resistance. (A) an epoxy resin represented by the formula (3); (B) a phenol resin represented by the formula (4); An epoxy resin composition for semiconductor encapsulation, comprising an inorganic filler and (D) a curing accelerator as essential components, wherein the total amount of inorganic substances is 87 to 94% by weight in the total epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008007692-A |
| priorityDate | 2000-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.