http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002141654-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2000-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8054475d2c9915e9060396515fe774aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_123037a0e0af4ca4fb70027d07af4b6a |
| publicationDate | 2002-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002141654-A |
| titleOfInvention | Printed wiring board |
| abstract | (57) [Summary] [PROBLEMS] To provide a printed wiring board capable of appropriately forming a low-melting-point metal-free bump containing no lead. SOLUTION: In order to form a field via 162 with the depth of the recess being less than 5 μm, the field via 162 is formed. Has a nearly flat shape. Therefore, when the high-viscosity Sn / Ag paste 77 is filled in the openings 71a and 71b, generation of voids can be prevented. |
| priorityDate | 2000-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.