http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002134907-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2000-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3ab705da36edd027fddf7fa4461907c |
| publicationDate | 2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002134907-A |
| titleOfInvention | Copper-clad laminates for flexible printed wiring boards and flexible printed wiring boards |
| abstract | (57) [Problem] To provide a novel copper-clad laminate for flexible printed wiring boards and a flexible printed wiring board which are excellent in workability at the time of preparing an adhesive composition and have excellent adhesiveness. it can. A copper-clad laminate for a flexible printed wiring board in which an insulating film and a copper foil are laminated and integrated via an adhesive composition containing a nitrile rubber containing a carboxyl group as an essential component, wherein the nitrile rubber is bonded to nitrile. Quantity 2 A copper-clad laminate for a flexible printed wiring board, comprising an adhesive composition comprising a copolymer of 5 to 30 wt% and a carboxyl group content of 2 to 4 mol%. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11691389-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190008526-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200138231-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019189811-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10251265-B2 |
| priorityDate | 2000-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.