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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
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filingDate 2000-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56304ec18898d97325fa52a8a49646fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8054475d2c9915e9060396515fe774aa
publicationDate 2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002134889-A
titleOfInvention Manufacturing method of printed wiring board
abstract PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board having uniform shape and height, forming solder bumps having no short circuit between each other, and having excellent connectivity and reliability. . A method for manufacturing a multilayer printed wiring board, characterized by performing at least the following steps (a) to (c). (A) a first solder paste printing step in which a solder paste is printed once or more in a predetermined area including a plurality of solder bump forming openings on a solder resist layer, and the solder bump forming openings are filled with the solder paste; (B) a solder paste removing step of removing solder paste other than the solder paste filled in the solder bump forming opening, and making the surface of the solder paste and the surface of the solder resist layer substantially flush with each other; (C) A second solder paste printing step of performing one or more solder paste printings.
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