Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate |
2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbc9b959eb4073dcee8a5d9ce47dd27f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c7c28e944bf324924d169aad74d705 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2ae679c20430c7773ce5e99641e00a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94da9c7705eb46d351cad886daab793d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070eeb461b3f6df27a361227c8489241 |
publicationDate |
2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2002134880-A |
titleOfInvention |
Manufacturing method of printed wiring board |
abstract |
(57) [Problem] To provide a method of manufacturing a printed wiring board which is excellent in suppressing occurrence of bumps in thin electroless copper plating and has few short-circuit defects between conductor circuits. In a method for manufacturing a printed wiring board, the method includes the steps of alternately forming an insulating resin layer and forming a wiring conductor on the surface by plating. A method for manufacturing a printed wiring board, comprising a step of removing a roughened residue by sonic cleaning. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8034188-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017016965-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4724547-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100710119-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004019664-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107923043-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007158238-A |
priorityDate |
2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |