http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002134857-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H13-26 |
| filingDate | 2000-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fe58c2deda33f29de64c2aba49b91a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ff4697ae6cbd7fab3e81f7cd0029d50 |
| publicationDate | 2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002134857-A |
| titleOfInvention | Printed circuit board laminate |
| abstract | PROBLEM TO BE SOLVED: To solve the conventional problems and to provide a novel print excellent in electrical connection reliability with less damage due to severe use conditions and aging and excellent surface smoothness. A laminate for a substrate is provided. The object of the present invention is to provide a printed circuit board laminate comprising a copper plate forming a wiring circuit and a separation layer for separating and insulating the copper plate, the laminate being disposed at least in the outermost layer of the printed board laminate. This is achieved by forming a copper plate laminated with a thin paper made of an aromatic polyamide fiber to form an integrated laminate for a printed circuit board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006200066-A |
| priorityDate | 2000-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.