| abstract |
(57) [Problem] In a conventional method of manufacturing a hybrid integrated circuit device, since a step of attaching a large part in order from small parts is performed, a thin wire bonder and a thick wire bonder are performed in separate steps. Therefore, there was a problem that the process days were required. A circuit element (4) fixed to a desired conductive path (2) of a hybrid integrated circuit board (1) with at least a conductive brazing material (3). 7 and 11 are collectively mounted and fused, and the circuit element 6 fixed to the conductive path 2 with the silver paste 5 is mounted and fixed, and then the thin wire and thick wire bonders 9 and 13 are collectively mounted. In particular, by performing the thin and thick wire bonders 9 and 13 collectively, the number of transfers between the solder process and the bonder process is reduced, and the transfer time and the working process are significantly reduced. is there. |