http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002134655-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070eeb461b3f6df27a361227c8489241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c7c28e944bf324924d169aad74d705 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2ae679c20430c7773ce5e99641e00a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94da9c7705eb46d351cad886daab793d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbc9b959eb4073dcee8a5d9ce47dd27f |
| publicationDate | 2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002134655-A |
| titleOfInvention | Semiconductor package substrate, method of manufacturing the same, semiconductor package and method of manufacturing the same |
| abstract | (57) [Summary] (Modified) [Problem] A substrate for a semiconductor package excellent in adhesion between a heat radiation slag and a substrate, resin sealing property of a chip mounting cavity, reliability of heat cycle, and productivity, and a method of manufacturing the same. I will provide a. A surface of a heat-dissipating slag (101) made of a copper plate is roughened, and a photo-curable photosensitive insulating resin film (102) is formed thereon. A copper pattern 103 is formed on the surface, a resist 104 is formed, and a circuit pattern 105 is formed by etching while leaving the internal and external connection terminals and wiring portions. A solder resist 106 for insulatingly covering the wiring conductor is formed. i / Au plating 107 is performed, and solder balls 108 are applied to complete a semiconductor package substrate. A semiconductor chip is mounted in the cavity, connected to the connection terminal, and the chip is sealed with a resin to form a semiconductor package. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013093614-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011249792-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004281849-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013093613-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7462555-B2 |
| priorityDate | 2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.