| abstract |
[PROBLEMS] To wind a bonding wire for a semiconductor element, which realizes a precise winding mode, enhances the straightness of the wire, and prolongs the life of a guide until a defect occurs in the wire. Providing guides and methods. A rewinding guide for a bonding wire for a semiconductor element in which a hard base material surface is coated with a film containing carbon and a super hard alloy component, preferably one of WC and TiC. In a method of winding a bonding wire that is guided by a winding guide and wound by a winding machine after the wire drawing process, the bonding wire unwound from the rewinding machine is wound with a super hard alloy component on a hard base material surface. A method of rewinding a bonding wire for a semiconductor element covered with a diamond-like carbon film contained therein. |