http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002134547-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fe3c91f54b5a7c6b47e19d1259a241fc
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-78
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate 2000-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72c19dd3cb33f38421e39d49900ef794
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_690a2c056cbb17d5375318ba19ee1c07
publicationDate 2002-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002134547-A
titleOfInvention Bonding wire winding guide and winding method using the same
abstract (57) [Summary] [Problem] Even if a bonding wire for semiconductor connection unreeled from a rewinding machine is guided by a rewinding guide and wound by a winding machine, the life of the guide until a wire defect is generated is reduced. Provided are a wire and a winding method that can be lengthened and improve straightness. SOLUTION: A rewinding guide for a bonding wire for a semiconductor element in which a hard base material surface is coated with a ceramic coating film. In a method of winding a bonding wire that is guided by a winding guide and wound by a winding machine after the wire drawing process, the bonding wire coated from a rewinding machine is coated with a ceramic coating film on a hard base material surface. Method for winding a bonding wire for a semiconductor element.
priorityDate 2000-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452908191
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID340523
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415762181
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159433
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID77322
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID340523

Total number of triples: 41.