http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002129347-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74415d2d575191b74012a38dc7a41110 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 2000-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07f6a7f1ba20c50549d8db98c9275574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2db18ba7505ef131775848196655b919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05553636d23e9011706224cf40fdde60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_461ef2ffcce369b1e58c34d13479a0dd |
| publicationDate | 2002-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002129347-A |
| titleOfInvention | Method for forming selective plating underlayer, selective plating underlayer, and substrate with fine metal wiring |
| abstract | PROBLEM TO BE SOLVED: To provide a low-cost method of forming a delicately patterned tin oxide-based selective plating base film excellent in mechanical and chemical stability. SOLUTION: (a) a chelate complex in which an organic ligand is coordinated with a Sn compound in an amount of 1 to 5% by weight in terms of SnO 2 with respect to a coating solution; and (b) 5 to 10% by weight of ultraviolet light with respect to the coating solution. A photosensitive coating liquid containing a curable or UV-degradable photosensitive resin and (c) a solvent is coated on a substrate with a photosensitive coating liquid for forming a selective plating underlayer, dried, and a photomask is placed thereon, and ultraviolet light is applied. After exposure, development and patterning are performed, followed by baking at 400 ° C. or higher to form a patterned selective plating base film. The substrate on which the base film was formed was immersed in a catalysis treatment bath to apply a plating catalyst, and then electroless plating was performed to selectively form a plating film on the patterned plating base film. Obtain a substrate with fine metal wiring. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010107363-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016160149-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022185933-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492077-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016140188-A1 |
| priorityDate | 2000-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.