abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in releasability, heat resistance, and eventually solder crack resistance and continuous moldability. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and E) an aromatic ring having a main chain skeleton and having 18 to 36 carbon atoms. An epoxy resin composition for semiconductor encapsulation, comprising a fatty acid bisamide comprising a fatty acid as an essential component. |