| abstract |
(57) Abstract: A composite sheet according to the present invention comprises a fibrous filler (A) having magnetism, a binder (B) cured by heat and / or light, and organic fine particles or inorganic fine particles (C). ) Wherein the fibrous filler (A) having magnetism is oriented in the thickness direction of the sheet. According to the composite sheet of the present invention, when the fibrous filler (A) has conductivity, the conductive portion has low resistance, high anisotropic conductivity in the thickness direction, heat resistance, mechanical strength and semiconductor. Excellent connection stability with the electrode part of the element. Also, Even when an excessive load is applied, the sheet thickness and the insulation in the vertical direction hardly decrease, and the durability is excellent. In addition, when the fibrous filler has thermal conductivity, it exhibits better thermal conductivity, which is effective in solving the problem of malfunction due to heat generation during driving of the semiconductor element. |