http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002121499-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 |
| filingDate | 2000-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e81a57fd36a1d84ffdd499de3a842eb1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3de91575d6ba3817e0b93ac3d2a4016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01a1f8a9a2b0eeb47cb43643b1bea410 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61cf80d82d9a7cd6fd61ae6a51e105c4 |
| publicationDate | 2002-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002121499-A |
| titleOfInvention | Adhesive composition for flexible substrate and method for producing flexible substrate |
| abstract | (57) [Problem] An object of the present invention is to block an adhesive layer surface of an integrated circuit formed on a laminate film in which a conductive metal foil is bonded to a plastic film without a metal foil. It is an object of the present invention to provide an adhesive composition and a method for manufacturing an integrated circuit, which can prevent the occurrence of the problem. SOLUTION: The first configuration is an adhesive for bonding a conductive metal thin film and a plastic film to form a conductive flexible substrate, which contains an active energy ray-curable composition. Adhesive composition for flexible substrates. A second configuration includes a step of laminating a conductive metal thin film and a plastic film using the adhesive composition, a step of forming a predetermined resist pattern on the metal thin film surface, a step of etching a non-image area, and an activity step. A method of manufacturing a flexible substrate, comprising a step of irradiating an energy ray to cure an adhesive composition layer in this order. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009299011-A |
| priorityDate | 2000-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.