abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which has a small warpage after molding or soldering and is excellent in solder crack resistance. SOLUTION: In an epoxy resin composition containing an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler as main components, a thermal bending in a temperature range from a molding temperature to a glass transition temperature of a cured product of the resin composition. The elastic modulus is 3000 N / mm 2 or less. |