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filingDate 2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38e2f2fbc148ada6b43ad2720dfcc5f7
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publicationDate 2002-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002118265-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Problem] A metal element used to promote crystallization of a semiconductor film has been a cause of impairing stability and reliability of electric characteristics when a TFT is manufactured. A semiconductor film is crystallized using a metal element for promoting crystallization in the semiconductor film. When selectively adding an impurity element to the crystallized semiconductor film, It is performed at a low temperature of 200 ° C. or less. By adding the impurity element at a low temperature, an amorphous state can be formed with a small amount of the impurity element. Thereafter, when a heat treatment is performed, recovery of crystallinity and gettering can be performed efficiently.
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