| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F226-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-34 |
| filingDate |
2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d952a37b24196c7e6e77e6053f011f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0587152f0e98544b9e8f618bfa7743c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d75f6483b8052d4f7b28bc2176a8fab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_225823cb0c81ff8d3389bfbfd07133c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f25ae21d3282ee91ab3893ffa14ee7 |
| publicationDate |
2002-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002114825-A |
| titleOfInvention |
Insulating resin composition and resin film using the same, laminated board with resin, wiring board |
| abstract |
PROBLEM TO BE SOLVED: To provide an insulating resin composition having high heat resistance and insulation reliability, which can be cured by light or heat, and an insulating adhesive and a method for manufacturing a wiring board using the same. SOLUTION: In a resin composition curable by light or heat, an insulating resin composition containing a bismaleimide compound and an isocyanuric ring compound having a double bond in a molecule as essential components is used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012072316-A |
| priorityDate |
2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |