| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2000-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d3482eca9a0f1ab785d8bda571f6567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54e761f27ccd464be9fdb688b9c51830 |
| publicationDate |
2002-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002105414-A |
| titleOfInvention |
Heat-sensitive adhesive material |
| abstract |
PROBLEM TO BE SOLVED: To provide a thermosensitive adhesive material having a thermosensitive adhesive layer mainly composed of a thermoplastic resin and a plasticizer provided on a support, and exhibiting excellent adhesive strength by heating. Provide materials. SOLUTION: In a heat-sensitive adhesive material provided on a support with a heat-sensitive adhesive layer mainly containing a thermoplastic resin and a plasticizer, the plasticizer is a hindered phenol compound, a benzotriazole compound, an aromatic sulfone. A heat-sensitive adhesive material comprising at least one compound which is solid at room temperature selected from amide compounds and phthalic acid compounds. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1685968-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006199950-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7790343-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2919070-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2072597-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006176591-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3825766-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7989529-B2 |
| priorityDate |
2000-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |